doc. no : qw0905-la110b/g.yg.g.yg-s1-pf rev. : a date : 24 - mar. - 2015 data sheet led array la110b/g.yg.g.yg-s1-pf pb lead-free parts ligitek electronics co.,ltd. property of ligitek only l dcc
12.45 part no. la110b/g.yg.g.yg-s1-pf 2.7 2.5 ? ???? ???? ??????
la110b/g.yg.g.yg-s1-pf part no. la110b/4yg-2-pf 160 4.59.0 1.72.6 56530 green gap white diffused g 120 100 10 30 ligitek electronics co.,ltd. property of ligitek only unit ma mw ?
3.0 2.5 1.5 1.0 0.5 0.0 2.0 fig.4 relative intensity vs. temperature 1.0 r e l a t i v e i n t e n s i t y @ 2 0 m a 550 wavelength (nm) 500 0.0 0.5 600650700 ambient temperature(
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature(
dip soldering preheat: 120
the purpose of this test is the resistance of the device under tropical for hours. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to see soldering well performed or not. 1.t.sol=245
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